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      1310nm 2.5G DFB Chip

      The products CLD-DBxx are directly modulated 2.5Gbps 1310nm edge-emitting DFB laser diode chips which are used in GPON with operating temperature range from –40°C up to 75°C. The design is a Ridge Waveguide on n-type substrate with multi-quantum well (MQW) active layers and gratings. These products utilize sophisticated cleaved facet technology and mirror coating processes, and regular codes printed on the top surface of each chip for identification purpose. All the laser chips come from the certified wafers which must achieve an acceptable yield for burn-in, aging tests, and each shipped laser chip is fully screened.

      • 1310nm Wavelength Range
        Low Power Dissipation
        High Output Power Efficiency
        Long Transmission Distance
        Ridge Waveguide Edge Emitting Lase (EEL)
        RoHS Compliant
        Designed for Telcordia GR-468
        Small Device Dimension

      • Uncooled Operation in Industrial Temperature from -40°C to 75°C
        2.5Gbps Transmitter Applications
        Optical Ethernet
        Fiber Channel
        GPON

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